Head of Product Development Engineering

📋 Description

• Lead Ethernovia’s products from NPI to high-volume manufacturing (HVM).
• Bridge world-class networking chip designs with automotive-grade silicon and manufacturing.
• Own end-to-end test ownership across pre-silicon to post-silicon, including ATE/SLT.
• Oversee NPI bring-up for high-speed Ethernet switch and PHY products, ensuring SI and
• Drive manufacturing flow from wafer starts to sample delivery and yield improvements.
• Collaborate with Arch, Design, SW/FW, DFT, System, Test, and R&D teams to meet automotive

🎯 Requirements

• Bachelor’s or Master’s in Electrical Engineering or related field.
• 12+ years in fabless semiconductor ops, with high-performance SOCs or networking ICs.
• Direct experience with ATE, SLT testing, characterization, and silicon/package qualification.
• Experience with foundries, OSATs, and test houses for high-volume products from NPI to HVM.
• Expertise in iJTAG, Scan, MBIST, Sensor, SerDes, LSIO/HSIO testing on ATE; DVFS and related testing.
• Knowledge of automotive electronics ecosystem (IATF 16949, ISO 26262, PPAP) and pre-silicon

🎁 Benefits

• Competitive base salary; pre-IPO stock options and comprehensive benefits.
• Pre IPO ISO options, medical/dental/vision insurance for employees.
• Flexible hours and opportunity to grow with a world-class team.
• 15+ patents filed; access to cutting-edge technology in packet processor networking.