Lead Package Assembly Integrator

Added
17 minutes ago
Type
Full time
Salary
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Related skills

thermal modeling design of experiments 3d packaging wafer-scale packaging photonic packaging

πŸ“‹ Description

  • Lead end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products
  • Develop and optimize package architectures for manufacturability and long-term reliability
  • Define test chip requirements and manage design for 3D package development
  • Develop and validate high-yield assembly design rules and perform experiments with partners
  • Collaborate with designers, silicon/photonics foundries, and OSAT partners to ensure
  • Communicate findings and methodologies to stakeholders and document results

🎯 Requirements

  • MS or PhD in Mechanical Engineering, Materials Science, or related field
  • Experience in wafer-scale packaging assembly process development
  • Knowledge of 2D/3D packaging technologies, materials, and equipment
  • Ability to define requirements for test chips and assembly test vehicles
  • Understanding of photonics packaging including fiber attach methods
  • Experience with advanced packaging technologies (thermal, mechanical, reliability)

🎁 Benefits

  • Comprehensive Health Care Plan (Medical, Dental & Vision)
  • Retirement Savings Matching
  • Life Insurance, Disability, and Paid Time Off
  • Training & Development and Commuter Benefits
  • Flexible, hybrid workplace model and Equity grants
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