Drive substrate layouts for IC packages from concept to production.
Work within Signal Integrity, Power Integrity and Packaging teams on multi-domain interactions.
Optimize layouts to meet SI/PI, thermal, DFA/DFM requirements.
Collaborate with suppliers and OSATs on design rules and stack-up.
Support tape-outs with iterative test routes and design automation.
Contribute to architecture pathfinding for advanced packaging (2.5D/3D IC, EMIB, etc.).

🎯 Requirements

BS or MS in Electrical Engineering or similar with ≥5 years of experience.
3–5+ years IC package layout design experience.
Proficient with Allegro X APD.
Understanding of IC package substrates and organic materials.

🎁 Benefits

Comprehensive Health Care Plan (Medical, Dental & Vision)
Retirement Savings Matching
Life Insurance (Basic, Voluntary & AD&D)
Generous Time Off (Vacation, Sick & Public Holidays)
Paid Family Leave
Equity grants for eligible employees

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