Packaging Architect

📋 Description

• Own development of advanced packaging solutions from concept to product release.
• Translate complex requirements into precise packaging specifications balancing performance, cost
• Serve as a technical decision-maker driving architecture trade-offs across product lifecycle.
• Collaborate with cross-functional teams across substrate design, signal integrity, and power
• Engage with product teams and customers in data center and HPC segments to influence roadmap.

🎯 Requirements

• Ph.D. or Master’s in Electrical, Mechanical, Materials Science, or related field.
• 15+ years in advanced (2D/3D) packaging with exposure to optical packaging.
• 10+ years in power/signal integrity, thermal-mechanical analysis, or optical packaging.
• System-level trade-off experience across silicon, package, and board for complex products.
• Extensive experience with high-speed interfaces (SERDES, PCIe, die-to-die) and impact on substrate
• Proven track record delivering packages from concept to production release.

🎁 Benefits

• Comprehensive Health Care Plan (Medical, Dental & Vision)
• Retirement Savings Matching Program
• Life Insurance (Basic, Voluntary & AD&D)
• Generous Time Off (Vacation, Sick & Public Holidays)
• Paid Family Leave
• Short Term & Long Term Disability