Application Engineering Director

Added
26 days ago
Type
Full time
Salary
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Related skills

thermal management materials characterization semiconductor packaging 2.5d/3d ic advanced packaging
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๐Ÿ“‹ Description

  • Lead and grow the application engineering function for packaging and thermal management.
  • Develop and deploy diamond-based solutions for advanced packaging and cooling.
  • Provide technical expertise on thermal management and material characterization.
  • Collaborate with R&D and product teams to define roadmaps and drive improvements.

๐ŸŽฏ Requirements

  • BS/MS in Materials Science, Chemistry, EE, or ME; 8+ years in packaging/thermal.
  • Deep knowledge of packaging tech, thermal management, and material characterization.
  • Proven ability to lead cross-functional engineering teams and customer engagement.
  • Experience with high-thermal-conductivity materials and advanced packaging.

๐ŸŽ Benefits

  • Health insurance and flexible spending accounts.
  • Retirement savings plans and life/disability insurance.
  • Paid and unpaid time off programs.
  • Employee discounts to VRAI.
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