Application Engineering Director

📋 Description

• Lead and grow the application engineering function, setting the technical direction for bonding
• Own the bonding technology strategy, including how we evaluate, select, and optimize pressure and
• Direct process development and validation, including surface preparation, metallization, DOE-based
• Serve as the senior technical lead on customer programs, from prototyping through qualification
• Partner with executive leadership, R&D, product, and business development on product roadmaps
• Present technical results and strategy to customers, executives, and industry partners.

🎯 Requirements

• Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical
• 10+ years of experience in semiconductor packaging, process engineering, or thermal management
• Deep, hands-on expertise in wafer/die bonding technologies and the related processes: surface
• Strong understanding of advanced packaging architectures (2.5D/3D IC, CoWoS, flip-chip, fan-out)
• Proven record of taking bonding or packaging processes from R&D through qualification and into
• Excellent communication and executive presence; able to translate complex technical issues into

🎁 Benefits

• Health insurance
• Flexible spending accounts
• Retirement savings plans
• Life and disability insurance programs
• Paid and unpaid time away from work
• Employee discounts to VRAI