Added
7 days ago
Type
Full time
Salary
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r&d thermal management semiconductor packaging technology transfer 2.5d/3d ic

๐Ÿ“‹ Description

  • Lead diamond packaging and thermal solution development.
  • Serve as SME in thermal management and material characterization.
  • Bridge R&D and customers; shape product roadmaps.
  • Guide customer integration from prototyping to production.
  • Collaborate with manufacturing, reliability, and sales.

๐ŸŽฏ Requirements

  • Bachelors or Masters in materials science, chemistry, EE, or ME; 5+ yrs packaging/thermal.
  • Deep understanding of packaging tech and thermal mgmt; 2.5D/3D IC.
  • Proven hands-on development, integration, mass production scaling.
  • Knowledge of systems engineering, high-thermal-conductivity materials, tech transfer.
  • Strong communication and cross-functional leadership.

๐ŸŽ Benefits

  • Health, vision, and retirement benefits.
  • Flexible spending accounts and life/disability insurance.
  • Paid time off and other time-off programs.
  • Employee discounts and wellness programs.
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