Principal IC Package Design Engineer

📋 Description

• Lead the definition of package concepts, substrate stack-ups, bump/ball maps, and pinouts
• Execute complex, high-speed, multi-layer package layouts (FCBGA, FCCSP, SiP)
• Partner with Signal/Power Integrity and Thermal engineers for SI/PI and thermal co-design
• Define design rules and manage substrate layout, routing optimization, and manufacturing
• Drive technical engagements with substrate suppliers and OSATs
• Act as the bridge between Silicon IC Design and System/PCB teams for chip-package-board co-design

🎯 Requirements

• B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
• 10+ years of direct experience in IC package design and architecture
• Proven track record in Flip-Chip BGA (FCBGA), System-in-Package (SiP), and multi-chip module (MCM)
• Expert proficiency in Cadence Allegro Package Designer (APD), SiP Layout, or Synopsys 3DIC Compiler
• Strong understanding of electromagnetic theory, transmission lines, crosstalk, and PDN concepts
• Deep understanding of substrate fabrication processes, assembly line limits, and automotive-grade

🎁 Benefits

• Pre-IPO stock options
• Competitive base salary
• Flexible hours
• Medical, dental and vision insurance
• Cutting edge technology
• World class team