Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis)

📋 Description

• Develop and qualify GGI and thermosonic flip-chip / die-attach processes, including bond force
• Develop gold stud bump, gold bump, and gold-to-gold interconnect processes and evaluate bond
• Develop and optimize vacuum mold lamination and related encapsulation (material selection, vacuum
• Support related assembly steps as needed: wafer/die handling, placement, plasma/surface cleaning
• Select and characterize assembly materials (adhesives, mold compounds, substrates, interconnect
• Specify, evaluate, install, and qualify assembly equipment (flip-chip bonders, thermosonic bonders

🎯 Requirements

• Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other
• 2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience