Develop and qualify wafer back-grinding, thinning, stress-relief, and backside finishing processes
Develop and optimize mechanical wafer dicing (including thin wafers and difficult materials such as
Establish post-dice die cleaning, drying, handling, tape mount/release (UV and non-UV), pick, sort
Develop and qualify laser marking processes for wafers and bare die (including green/UV sources)
Develop final package singulation (saw, laser, or mechanical) for organic, mold, ceramic, and metal
Run DOEs, define process windows and controls, troubleshoot defects, qualify equipment and

🎯 Requirements

Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other
2+ years of hands-on experience in semiconductor wafer processing, thinning, dicing, die

Apply on employer's website

This employer gathers applications via their own applicant tracking system.

You will be redirected to an external application form.

Get alerts for new remote engineering jobs

A weekly email with new matches. Unsubscribe anytime.

Share job

Meet JobCopilot: Your Personal AI Job Hunter

Automatically Apply to Engineering Jobs. Just set your preferences and Job Copilot will do the rest — finding, filtering, and applying while you focus on what matters.

Activate JobCopilot