Senior Director, Physical Design & Backend Engineering (HPC)

📋 Description

• End-to-end backend delivery from RTL to tape-out.
• Lead and scale globally distributed backend teams.
• Meet PPA targets with quality signoff.
• Enable advanced node design methodologies and tool flows.
• Align architecture with physical implementation across teams.
• Standardize ways of working using data-driven metrics.

🎯 Requirements

• Master’s degree in Electrical or Computer Engineering.
• 20+ years in semiconductor design with focus on physical design.
• Proven track record leading large global teams.
• RTL-to-GDSII flow, advanced node signoff, SoC/MCU.
• Leadership: cross-functional, data-driven decisions.
• Preferred: HPC, automotive, or advanced SoC domains.