Silicon Packaging Technician, Silicon Assembly (Starlink)

📋 Description

• Operate and maintain deposition systems (PVD) for thin films.
• Operate photolithography tools for resist coating, alignment, exposure, and development.
• Monitor processes with in-situ sensors and metrology (3D profilometer, XRF) for film quality.
• Operate dicing saws, laser dicers, and plasma etchers for wafer/panel singulation per recipes.
• Load/unload materials into molding systems to optimize mold fill and minimize voids.
• Operate die attach equipment (epoxy dispensers, pick-and-place, reflow) for precise die placement.

🎯 Requirements

• High school diploma or GED.
• 3+ years in hands-on manufacturing OR an associate’s degree in engineering/math/science.
• 6+ years in high-volume semiconductor manufacturing.
• Proficiency in photolithography, electrochemical plating, die attach, molding, dicing, plasma/RIE.
• Data analysis and SPC software proficiency.
• Metrology experience with C-SAM, 3D profilometers, XRF.