Own end-to-end root cause failure analysis investigations on microelectronics failing in
Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF
Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related
Apply physics-of-failure principles and deep knowledge of semiconductor failure modes
Drive corrective actions by working directly with silicon design, packaging, and manufacturing
Author detailed technical reports documenting failure modes, root cause conclusions, supporting

🎯 Requirements

Bachelor's degree in materials science, electrical engineering, physics, chemical engineering, or
5+ years of hands-on experience in microelectronics failure analysis or materials characterization

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