Own and drive advanced package selection, new product BGA configuration and package structure
Responsible for package/SIP layout, optimization, design verification and tapeout
Interface and coordinate with cross-functional groups throughout SpaceX on new product package
Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan
Simulate and optimize signal/power integrity and RF performance of the package design
Drive methodology, innovations, and productivity improvements in package design

🎯 Requirements

Bachelor's degree in electrical engineering, computer engineering, or physics
5+ years of experience with IC package design

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