Sr. Process Engineer (Starlink)

Added
16 days ago
Type
Full time
Salary
Salary not provided

Related skills

root cause analysis statistical process control semiconductor packaging wire bonding flip-chip bonding
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πŸ“‹ Description

  • Own daily operation and uptime of production tools.
  • Design production processes from lab bench to ramp.
  • Monitor key process parameters for repeatability.
  • Troubleshoot tool/process issues to minimize downtime.
  • Collaborate to stabilize die attach, bonding, cleaning, packaging.
  • Analyze production data and yields to drive improvements.

🎯 Requirements

  • BS or MS in an engineering discipline.
  • 5+ years in semiconductor packaging, assembly, or advanced manufacturing.
  • Strong troubleshooting and real-time problem solving.
  • Experience with flip-chip bonding, wafer processing, plasma cleaning, or wire bonding.
  • Knowledge of statistical process control and root cause analysis.
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