Develop and run thermal and mechanical FE models and simulations.
Create process models for new production line bring-up.
Design and run thermal and mechanical test campaigns.
Perform board-level thermal characterization: heat spreading and junction temps.
Operate and maintain thermal chambers, thermocouples, and infrared cameras.
Analyze test data, correlate results with models, and provide feedback to packaging and design teams.

🎯 Requirements

Bachelor's degree in engineering, math, or science.
1+ years of thermal or mechanical modeling and testing experience.
Experience with board-level thermal testing and IR thermography.
Proficiency with FEM tools: ANSYS, Abaqus, COMSOL, Icepak.
Proficiency in Python or MATLAB for data analysis.
Background in semiconductor packaging or high-reliability electronics environments.

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